marginal microleakage and morphological characteristics of a solvent-free one-step self-etch adhesive (b1sf).

نویسندگان

maryam khoroushi associate professor, dental materials research center and department of operative dentistry, school of dentistry, isfahan university of medical sciences, isfahan, iran.

farinaz shirban

mohammadreza shirban

چکیده

in recent years, newly developed solvent-free dental adhesives have been introduced. the aim of this study was to evaluate the marginal integrity of a new one-step solvent-free self-etch adhesive and to compare it with a commonly used two-step self-etch adhesive as the gold standard.class v cavities (2×4×1.5 mm) were prepared on the buccal aspects of 28 human premolars. the cervical margins of the cavity preparations were placed 1 mm apical to the cej. clearfil se bond (cseb) (two-step self-etch adhesive) and bond 1sf (b1sf) (one-step self-etch adhesive) were applied to the cavities in groups 1 and 2 (n=14), respectively. then, the specimens were restored with a2 shade of apx composite resin. each group was evaluated for dye penetration under a stereomicroscope at ×32 after 24 hours and 500 rounds of thermocycling. statistical analyses were carried out using mann whitney test (α=0.05). in addition, in each experimental group, two specimens were prepared for analysis under sem.there were no significant differences in enamel margin microleakage between the two adhesives used (p=0.24(; whereas, there were significant differences in dentin margin microleakage between cseb and b1sf (p=0.004). dentin microleakage of b1sf was higher than that of cseb.results showed that the enamel marginal integrity of b1sf as a newly developed one-step solvent-free self-etch adhesive was similar to that of cseb as a commonly used two-step self-etch; however, dentinal sealing of cseb was better than that of b1sf.

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Marginal Microleakage and Morphological Characteristics of a Solvent-Free One-Step Self-Etch Adhesive (B1SF)

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عنوان ژورنال:
journal of dentistry, tehran university of medical sciences

جلد ۱۰، شماره ۱، صفحات ۳۲-۴۰

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